JPH0255177B2 - - Google Patents

Info

Publication number
JPH0255177B2
JPH0255177B2 JP60008807A JP880785A JPH0255177B2 JP H0255177 B2 JPH0255177 B2 JP H0255177B2 JP 60008807 A JP60008807 A JP 60008807A JP 880785 A JP880785 A JP 880785A JP H0255177 B2 JPH0255177 B2 JP H0255177B2
Authority
JP
Japan
Prior art keywords
axis direction
printed circuit
circuit board
positioning
engagement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60008807A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61168446A (ja
Inventor
Koichi Asai
Mamoru Tsuda
Jiro Kodama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Corp
Original Assignee
Fuji Machine Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Machine Manufacturing Co Ltd filed Critical Fuji Machine Manufacturing Co Ltd
Priority to JP60008807A priority Critical patent/JPS61168446A/ja
Priority to US06/819,021 priority patent/US4649635A/en
Priority to EP86300314A priority patent/EP0189290B1/en
Priority to DE8686300314T priority patent/DE3679413D1/de
Publication of JPS61168446A publication Critical patent/JPS61168446A/ja
Publication of JPH0255177B2 publication Critical patent/JPH0255177B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/5313Means to assemble electrical device
    • Y10T29/53174Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53183Multilead component
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/5313Means to assemble electrical device
    • Y10T29/53261Means to align and advance work part
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T74/00Machine element or mechanism
    • Y10T74/20Control lever and linkage systems
    • Y10T74/20207Multiple controlling elements for single controlled element

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Jigs For Machine Tools (AREA)
  • Control Of Conveyors (AREA)
JP60008807A 1985-01-21 1985-01-21 プリント基板位置決め装置 Granted JPS61168446A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP60008807A JPS61168446A (ja) 1985-01-21 1985-01-21 プリント基板位置決め装置
US06/819,021 US4649635A (en) 1985-01-21 1986-01-15 Apparatus for positioning substrates of different sizes of printed-wiring boards
EP86300314A EP0189290B1 (en) 1985-01-21 1986-01-17 Apparatus for positioning substrates of different sizes of printed-wiring boards
DE8686300314T DE3679413D1 (de) 1985-01-21 1986-01-17 Vorrichtung zum positionieren von substraten verschiedener groesse von gedruckten schaltungen.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60008807A JPS61168446A (ja) 1985-01-21 1985-01-21 プリント基板位置決め装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP61022426A Division JPS61197138A (ja) 1986-02-04 1986-02-04 調節可能なプリント基板位置決め装置

Publications (2)

Publication Number Publication Date
JPS61168446A JPS61168446A (ja) 1986-07-30
JPH0255177B2 true JPH0255177B2 (en]) 1990-11-26

Family

ID=11703106

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60008807A Granted JPS61168446A (ja) 1985-01-21 1985-01-21 プリント基板位置決め装置

Country Status (4)

Country Link
US (1) US4649635A (en])
EP (1) EP0189290B1 (en])
JP (1) JPS61168446A (en])
DE (1) DE3679413D1 (en])

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0432194Y2 (en]) * 1985-02-15 1992-08-03
JPH06880Y2 (ja) * 1986-12-10 1994-01-05 三洋電機株式会社 基板支持装置
JPH0646645B2 (ja) * 1988-08-25 1994-06-15 株式会社東芝 リードフレーム搬送装置
JP2513031B2 (ja) * 1989-05-26 1996-07-03 日本電気株式会社 バスライン・システム
JPH0810795B2 (ja) * 1989-09-06 1996-01-31 松下電器産業株式会社 電子部品の実装装置及び実装方法
US6066206A (en) 1997-02-21 2000-05-23 Speedline Technologies, Inc. Dual track stenciling system with solder gathering head
US5873939A (en) * 1997-02-21 1999-02-23 Doyle; Dennis G. Dual track stencil/screen printer
US6189448B1 (en) 1997-11-07 2001-02-20 O'neal Dennis Dual image stencil apparatus having stencil including sections with curled edges
US6032577A (en) 1998-03-02 2000-03-07 Mpm Corporation Method and apparatus for transporting substrates
JP4268318B2 (ja) * 2000-06-29 2009-05-27 芝浦メカトロニクス株式会社 基板搬送装置および基板搬送方法
US6631798B1 (en) * 2000-11-01 2003-10-14 Micron Technology, Inc. Printed circuit board support
US20030221312A1 (en) * 2002-05-31 2003-12-04 Ta Liang Technology Co., Ltd. PCB auto-unloading mechanism
US7093704B2 (en) * 2004-08-17 2006-08-22 Micron Technology, Inc. Printed circuit board support
JP5258232B2 (ja) * 2007-08-30 2013-08-07 株式会社ミマキエンジニアリング 印刷装置
JP6539738B2 (ja) * 2015-07-15 2019-07-03 株式会社Fuji 対基板作業機、および対基板作業システム
CN110430745B (zh) * 2019-08-23 2024-07-02 南京信息职业技术学院 一种用于电子制造的贴片机
CN114585162B (zh) * 2022-04-28 2022-07-26 深圳市恒讯通电子有限公司 一种印刷电路用基板定位装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3395439A (en) * 1965-10-20 1968-08-06 Palesi Marie Apparatus for attaching components to a circuit board
FR2365209A1 (fr) * 1976-09-20 1978-04-14 Cii Honeywell Bull Procede pour le montage de micro-plaquettes de circuits integres sur un substrat et installation pour sa mise en oeuvre
US4283847A (en) * 1979-05-24 1981-08-18 Lear Siegler, Inc. Circuit board assembly
AT371045B (de) * 1980-03-21 1983-05-25 Schelling & Co Einrichtung an auflagetischen fuer werkzeugmaschinen zum ausrichten von grossformatigen, streifen- oder plattenfoermigen werkstuecken
JPS60189291A (ja) * 1984-03-09 1985-09-26 株式会社日立製作所 電子部品の自動插入装置

Also Published As

Publication number Publication date
DE3679413D1 (de) 1991-07-04
EP0189290A2 (en) 1986-07-30
US4649635A (en) 1987-03-17
JPS61168446A (ja) 1986-07-30
EP0189290A3 (en) 1987-08-05
EP0189290B1 (en) 1991-05-29

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees