JPH0255177B2 - - Google Patents
Info
- Publication number
- JPH0255177B2 JPH0255177B2 JP60008807A JP880785A JPH0255177B2 JP H0255177 B2 JPH0255177 B2 JP H0255177B2 JP 60008807 A JP60008807 A JP 60008807A JP 880785 A JP880785 A JP 880785A JP H0255177 B2 JPH0255177 B2 JP H0255177B2
- Authority
- JP
- Japan
- Prior art keywords
- axis direction
- printed circuit
- circuit board
- positioning
- engagement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000007246 mechanism Effects 0.000 claims description 21
- 230000008859 change Effects 0.000 description 5
- 238000013459 approach Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005553 drilling Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53183—Multilead component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53261—Means to align and advance work part
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T74/00—Machine element or mechanism
- Y10T74/20—Control lever and linkage systems
- Y10T74/20207—Multiple controlling elements for single controlled element
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Jigs For Machine Tools (AREA)
- Control Of Conveyors (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60008807A JPS61168446A (ja) | 1985-01-21 | 1985-01-21 | プリント基板位置決め装置 |
US06/819,021 US4649635A (en) | 1985-01-21 | 1986-01-15 | Apparatus for positioning substrates of different sizes of printed-wiring boards |
EP86300314A EP0189290B1 (en) | 1985-01-21 | 1986-01-17 | Apparatus for positioning substrates of different sizes of printed-wiring boards |
DE8686300314T DE3679413D1 (de) | 1985-01-21 | 1986-01-17 | Vorrichtung zum positionieren von substraten verschiedener groesse von gedruckten schaltungen. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60008807A JPS61168446A (ja) | 1985-01-21 | 1985-01-21 | プリント基板位置決め装置 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP61022426A Division JPS61197138A (ja) | 1986-02-04 | 1986-02-04 | 調節可能なプリント基板位置決め装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61168446A JPS61168446A (ja) | 1986-07-30 |
JPH0255177B2 true JPH0255177B2 (en]) | 1990-11-26 |
Family
ID=11703106
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60008807A Granted JPS61168446A (ja) | 1985-01-21 | 1985-01-21 | プリント基板位置決め装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US4649635A (en]) |
EP (1) | EP0189290B1 (en]) |
JP (1) | JPS61168446A (en]) |
DE (1) | DE3679413D1 (en]) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0432194Y2 (en]) * | 1985-02-15 | 1992-08-03 | ||
JPH06880Y2 (ja) * | 1986-12-10 | 1994-01-05 | 三洋電機株式会社 | 基板支持装置 |
JPH0646645B2 (ja) * | 1988-08-25 | 1994-06-15 | 株式会社東芝 | リードフレーム搬送装置 |
JP2513031B2 (ja) * | 1989-05-26 | 1996-07-03 | 日本電気株式会社 | バスライン・システム |
JPH0810795B2 (ja) * | 1989-09-06 | 1996-01-31 | 松下電器産業株式会社 | 電子部品の実装装置及び実装方法 |
US6066206A (en) | 1997-02-21 | 2000-05-23 | Speedline Technologies, Inc. | Dual track stenciling system with solder gathering head |
US5873939A (en) * | 1997-02-21 | 1999-02-23 | Doyle; Dennis G. | Dual track stencil/screen printer |
US6189448B1 (en) | 1997-11-07 | 2001-02-20 | O'neal Dennis | Dual image stencil apparatus having stencil including sections with curled edges |
US6032577A (en) | 1998-03-02 | 2000-03-07 | Mpm Corporation | Method and apparatus for transporting substrates |
JP4268318B2 (ja) * | 2000-06-29 | 2009-05-27 | 芝浦メカトロニクス株式会社 | 基板搬送装置および基板搬送方法 |
US6631798B1 (en) * | 2000-11-01 | 2003-10-14 | Micron Technology, Inc. | Printed circuit board support |
US20030221312A1 (en) * | 2002-05-31 | 2003-12-04 | Ta Liang Technology Co., Ltd. | PCB auto-unloading mechanism |
US7093704B2 (en) * | 2004-08-17 | 2006-08-22 | Micron Technology, Inc. | Printed circuit board support |
JP5258232B2 (ja) * | 2007-08-30 | 2013-08-07 | 株式会社ミマキエンジニアリング | 印刷装置 |
JP6539738B2 (ja) * | 2015-07-15 | 2019-07-03 | 株式会社Fuji | 対基板作業機、および対基板作業システム |
CN110430745B (zh) * | 2019-08-23 | 2024-07-02 | 南京信息职业技术学院 | 一种用于电子制造的贴片机 |
CN114585162B (zh) * | 2022-04-28 | 2022-07-26 | 深圳市恒讯通电子有限公司 | 一种印刷电路用基板定位装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3395439A (en) * | 1965-10-20 | 1968-08-06 | Palesi Marie | Apparatus for attaching components to a circuit board |
FR2365209A1 (fr) * | 1976-09-20 | 1978-04-14 | Cii Honeywell Bull | Procede pour le montage de micro-plaquettes de circuits integres sur un substrat et installation pour sa mise en oeuvre |
US4283847A (en) * | 1979-05-24 | 1981-08-18 | Lear Siegler, Inc. | Circuit board assembly |
AT371045B (de) * | 1980-03-21 | 1983-05-25 | Schelling & Co | Einrichtung an auflagetischen fuer werkzeugmaschinen zum ausrichten von grossformatigen, streifen- oder plattenfoermigen werkstuecken |
JPS60189291A (ja) * | 1984-03-09 | 1985-09-26 | 株式会社日立製作所 | 電子部品の自動插入装置 |
-
1985
- 1985-01-21 JP JP60008807A patent/JPS61168446A/ja active Granted
-
1986
- 1986-01-15 US US06/819,021 patent/US4649635A/en not_active Expired - Lifetime
- 1986-01-17 DE DE8686300314T patent/DE3679413D1/de not_active Expired - Lifetime
- 1986-01-17 EP EP86300314A patent/EP0189290B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE3679413D1 (de) | 1991-07-04 |
EP0189290A2 (en) | 1986-07-30 |
US4649635A (en) | 1987-03-17 |
JPS61168446A (ja) | 1986-07-30 |
EP0189290A3 (en) | 1987-08-05 |
EP0189290B1 (en) | 1991-05-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |